ViaKing

ViaKingR is MKS’ Atotech’s enhanced graphite-based direct metallization process. Optimized
for both high and low volume production needs, ViaKingR operates with an attractive CoO
but offers the highest product reliability and capability.
Designed to operate with low etch conditions, in combination with a stable and long-life
graphite bath, ViaKingR provides excellent stability, conductivity and electrical integrity for
market-leading high yield electrolytic plating.

‧ Compatible with a very wide range of dielectric materials
‧ Direct Cu to Cu adhesion for maximum reliability
‧ Low etch depth for minimal copper removal on inner layers – reduced risk of etch back
ICD or voids
‧ Unique Conductivator formulation is highly resistant to bacterial and copper contamination
‧ Wide operating window and enhanced bath stability
‧ Outstanding plating propagation
‧ Suitable for both panel and pattern plate technologies
‧ Ideal for both high volume as well as low volume or stop

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