Solutions:
Brown Oxide with high market share, SF-Bond of High speed/high frequency; Supper thin surace copper via-filing, High Densily/ Quick via-filling, MSAP Paltem Via-filling, Pulse Electroplating Copper Plating Procedure and other series of copper plating; High Corrosion Resistance, lmmersion Thick Gold Series ENEPlG, excelent performance of duckling resistance and other series of ENIG/ ENEPIG.
Specialty Chemicals:
Copper Oxide, Copper Sulfate, Nickel Sulfate, Nickel Sulfamate, MSA(Tin MSA), etc.
Chemical Reagents:
Specialty chemicals:sulfuric acid,phosphoric acid,sodiumhydroxide, sodium thiosulfate, ethyl alcohol, ipa, sodium carbonate, etc.