NANO ELECTRONICS AND MICRO SYSTEM TECHNOLOGIES, INC.

NANO ELECTRONICS AND MICRO SYSTEM TECHNOLOGIES, INC.

1. In-line Plasma Desmear Machine Designed for HDI and ABF substrates. Featuring patented high-density ICP plasma, the system enables simultaneous front- and back-side treatment, effective residue removal, and full in-line automation. 2. Dry Process Plasma Etching Machine Based on Microwave and ICP-RIE architectures, offering high uniformity, low damage, and high etching efficiency for ABF materials, resins, and fine-line PCB structures. 3. Plasma Drilling Machine Suitable for microvias and high aspect ratio vias, delivering smooth via sidewalls and consistent quality beyond conventional mechanical drilling limits. 4. Plasma Cleaning & Surface Treatment Machine Enhances surface activation and interlayer adhesion, widely used in PCB and substrate pre-treatment processes.