HIGH DEPOSITING SPEED / HIGH CURRENT REVERSE PULSE PLATING TECHNOLOGY To meet increasing demand from the FOPLP and Interposer markets, Schloetter has recently developed SLOTOCOUP ME 2150: and electroplated copper electrolyte product. This product has excellent via-filling capabilities and copper coverage inside holes, making it particularly suitable for TGV (Through Glass Via) products, ensure a more efficient process and superior electrical performance.
Application: - FOPLP (Fan out panel level package) - IC interposer - Hyper speed server and communication sever - IC - Redistribution layer (RDL)