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Description
1. Good selectivity. The gold surface is not easy to be OSP films, oxidized or discolored;
2. Excellent solderability, especially suitable for wave soldering of DIMM holes.
3. OSP films has excellent heat resistance and can withstand 5x lead-free relfow.
2. Excellent solderability, especially suitable for wave soldering of DIMM holes.
3. OSP films has excellent heat resistance and can withstand 5x lead-free relfow.
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