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Description
New-generation high uniformity BMV filling technology for advance substate application.
SLOTOCOUP SF 80 BMV filling technology provides exceptional copper plating distribution and low flat-ratio trace shape. This enhances performance to meet the requirements of advanced substrate manufacturing.
Benefits:
- Outstanding plating copper distribution
- Low profile trace shape
Application:
- Mega scale unit IC substrate
- Hyper computing IC substrate
SLOTOCOUP SF 80 BMV filling technology provides exceptional copper plating distribution and low flat-ratio trace shape. This enhances performance to meet the requirements of advanced substrate manufacturing.
Benefits:
- Outstanding plating copper distribution
- Low profile trace shape
Application:
- Mega scale unit IC substrate
- Hyper computing IC substrate
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